Reagglomeration Specific Diamond Micro Powder in Semiconductor

• Type: Diamond
• Classification of Diamond: Artificial
• Characteristic: High Hardness
• Characteristics of Natural Diamond: Compressive Strength
• Synthesis of Cubic Boron Nitride Method: Static High Pressure Catalytic Method
• Application: Microelectronics
• Hardness: 10 Mohs
• Sample: All Sizes Are Available
• Packing: Plastic Bag, Bottle, Carton Box
• Leading Time: 5 Days After Payment
• Appearance: Powder
• Transport Package: According to Customers
• Specification: 0.1-50um
• Origin: China
• HS Code: 7105102000
• Production Capacity: 2000kg/Month

Product Description

 

Product Description

 

Diamond micro powder refers to diamond particles with a particle size finer than 54 microns.

Single crystal diamond micro powder is produced by the static pressure method of artificial diamond single crystal grinding particles, which are crushed, shaped, and processed using a special process method of superhard materials.

Diamond micro powder has high hardness, good wear resistance, and concentrated particle size, and can be widely used in cutting, grinding, drilling, polishing, etc. It is an ideal raw material for grinding and polishing high hardness materials such as hard alloys, ceramics, gemstones, optical glasses, etc.

 

Grit Size

 

Grit	Mesh	Grit	Mesh
0-0.25	60000	5-10	2000
0-0.5	30000	6-12	1800
0-1	15000	8-12	1600
0-2	13000	7-14	1500
1-2	12000	8-16	1300
1-3	10000	10-20	1200
2-3	7000	12-22	1000
2-4	6500	15-25	800
2-4	6000	20-30	700
2-5	5000	22-36	600
3-6	4000	20-40	500
4-6	3500	30-40	450
4-8	3000	35-45	400
4-6	2500	36-54

 

Classification

Special Grinding and Polishing Micro-Powder


The raw material has high strength, sharp morphology, concentrated particle size, and satble and good performance.

Applicable to the ultra-precision machining and grinding polishing of fine ceramics, integrated circuit chips, gemstones, quartz, optical lenses, glass, and other hard and brittle materials. It serves as an additive for wear-resistant composite materials, composite coatings, and lubricating materials.

Simultaneously, it finds extensive applications in industries such as aerospace, precision machinery, optical instruments, and automotive manufacturing, making it an ideal polishing material.

 

Micro Powder for Cutting and Grinding Tools


Grinding tools require regularity in micro-powder, with a focus on particle size, high strength, and the elimination of large particles.


Application

Diamond wire drawing dies, resin diamond grinding tools, ceramic diamond grinding tools, metal diamond grinding tools, electroplated grinding wheels, cutting tools, ceramics, and materials such as glass and metal for grinding and polishing.

 

Special Diamond Composite Powder for Cutting Tools


In response to the requirements of diamond composite materials, improvements and modifications have been made to HDP (High-Density Polyethylene) products. The rational particle size distribution increases the compactness of the particles, making it easier to achieve stable bonding during the synthesis of composite materials.


Application

High-end diamond polycrystalline, diamond composite sheets, PCD (polycrystalline diamond), PDC (polycrystalline diamond compact), metal-bonded and ceramic-bonded abrasive tools, polycrystalline wire drawing dies, etc.

 

Application

1. High end precision gemstones, lenses, metallographic consumables, LCD panels, LCD glass, sapphire, quartz sheets, LED sapphire substrates, ceramic materials, and other precision grinding and polishing.

2. High end diamond polycrystalline, diamond composite sheets, metal and ceramic bonding grinding tools, polycrystalline drawing dies.

3. Diamond wire saws (single crystal silicon, polycrystalline silicon wafer wire cutting), glass grinding wheels, optical glass grinding wheels, ultra-thin cutting blades and other electroplated products.

4. Semiconductor industry and diamond grinding head products, with concentrated particle size and high strength.
Due to its high hardness, good thermal conductivity and chemical stability, agglomerated diamond micropowder is widely used in the grinding and polishing process of semiconductor devices, especially in the processing of semiconductor wafers, such as sapphire wafers, silicon carbide wafers and so on. The fine particle structure of agglomerated diamond powders enables efficient removal of impurities from the wafer surface and enhances the finish, thus improving the performance and reliability of the devices.
 

Packaging & Shipping

 

FAQ

Q1: What's the leading time after order confirmed? 
A: Generally, it can be sent out within 7 days after order confirmed.
 
Q2: Can you provide free samples?
A: Yes,we can provide free glass beads but don't pay cost of the freight.
 
Q3: What is the MOQ?
A: According to customer's demands.
 
Q4: What's the payment term?
A: T/T payment in general.
 
Q5: What's your international market?
A: We can send to anywhere that the international express can deliver.